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Leading Edge Flip Chip Technology

Established in 2005, NEPES Pte Ltd Singapore is dedicated to be an integral link for Advanced Flip Chip + WLP (Wafer Level Packaging) requirements between the Wafer Foundries and OSATs (Outsource Assembly & Test) as well as other Backend Packaging companies.

Core technologies are obtained from key stakeholder NEPES corporation (KOSDAQ: NEPES 033640) which was established in 1990 and have been running Semiconductor operations since 2000.

To meet requirements of compact, thinner, lighter weight and functionality semiconductor chip integrations into the latest electronics applications, ex. Mobile phone, Digital camera, Lap top…etc
Nepes Pte Ltd is bridging the transition from wirebonded to Flipchip & Wafer Level packages with our knowledge and expertise.

NEPES = Quality guaranteed

Nepes is committed to total customer satisfaction by providing quality products and agile services at competitive pricing through technological advancement and continual improvement of its quality management system.
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