NEPES P te. Ltd. is aiming to be a global leading company in Flip Chip bumping Packaging business, established in 2005 and dedicated to provide the service to link wafer foundries and backend packaging companies in Singapore .

As a major shareholder , NEPES Corp. who is established in 1990 and sole flip chip packaging foundry in Korea has transferred whole technology and know-how related to flip chip since it started semi-conductor business in 2000.